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Today on Design-Reuse.com
Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X ...
Using Samsung Foundry's SF4X 4nm advanced process, the latest BlueLynx PHY supports both standard 2D and advanced 2.5D packages and enables system designers ... Read
YorChip, Inc. announces development of a Universal PHY enabling customers to develop Open Chiplets and ASIC solutions using a single die-to-die PHY. Read
PQShield announces participation in NEDO program to implement post-quantum cryptography across ...
PQShield has joined the Cyber Research Consortium (CRC) in Japan to participate in its program with the Japanese government’s New Energy and Industrial ... Read
Under this agreement, Ambarella will utilize Qualitas C/D-PHY IP, implemented on the 5nm process, to apply it to its next-generation AI engine, CVflow®-based ... Read
This new IP core implements the Module-Lattice Key Encapsulation Mechanism (ML-KEM) as specified in the NIST FIPS 203 standard, and is CAST’s first ... Read
InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission ...
The next-generation UCIe physical layer IP, based on TSMC's N4 process, is expected to finalize its design later this year, supporting data transmission ... Read
Industry Expert Blogs
Alphawave Semi
Al Yanes, PCI-SIG President and Chairperson
Gervais Fong, Morten Christiansen (Synopsys)
Sanjeet Kumar, Cadence
New Products
- 90nm OTP Non Volatile Memory for Standard CMOS Logic Process
- 1.8V/3.3V I2C 5V Failsafe Failtolerant Automotive Grade 1 in ...
- Ultra High Performance 64-bit RISC-V Embedded Processor
- UniPHY™ IoT IP: Ultra Low Power and Smallest PHY area for ...
- USB 2.0 femtoPHY in Samsung (14nm, 11nm, 8nm, 7nm, 5nm, SF4X) ...
Industry Articles
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Accelerating RISC-V development with Tessent UltraSight-V
Francisca Tan
Tessent Embedded Analytics -
Automotive Ethernet Security Using MACsec
Comcores
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What is JESD204C? A quick glance at the standard
Chip Interfaces
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Optimizing Power Efficiency in SOC with PVT Sensor-Assisted DVFS Technology
Innosilicon
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Bandgap Reference (BGR) Circuit Design and Transient Analysis in 90nm VLSI Technology
Ram Niwas
eInfochips (An Arrow Company) -
Quantum Readiness Considerations for Suppliers and Manufacturers
Graeme Hickey
PQShield -
A Rad Hard ASIC Design Approach: Triple Modular Redundancy (TMR)
AsicNorth
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Early Interactive Short Isolation for Faster SoC Verification
Ritu Walia
Siemens